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Relife 10CC 183℃ No-Clean Syringe Solder Paste Flux for BGA Repair
Relife RL-403 High Quality 10CC Syringe Solder Paste Flux Soldering Paste Tin Sn63 / Pb67 20-38um for Phone Motherboard BGA Soldering Repair.
Specification:
Features:
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive.
Note: solder paste can only be sent out by special post mail.
Package includes:
Specification:
- Name: Relife RL-403 183℃ solder paste (syringe)
- Specifications: 10cc
- Alloy: Sn63/Pb37
- Microns: 20-38um
Features:
- Good adhesion. Paste delicate, particles small, only 20~38 microns.
- Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding.
- Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive.
Note: solder paste can only be sent out by special post mail.
Package includes:
- 1pc x Relife RL-403 Solder Paste
Relife RL-403 High Quality 10CC Syringe Solder Paste Flux Soldering Paste Tin Sn63 / Pb67 20-38um for Phone Motherboard BGA Soldering Repair.
Specification:
Features:
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive.
Note: solder paste can only be sent out by special post mail.
Package includes:
Specification:
- Name: Relife RL-403 183℃ solder paste (syringe)
- Specifications: 10cc
- Alloy: Sn63/Pb37
- Microns: 20-38um
Features:
- Good adhesion. Paste delicate, particles small, only 20~38 microns.
- Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding.
- Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive.
Note: solder paste can only be sent out by special post mail.
Package includes:
- 1pc x Relife RL-403 Solder Paste
$1.00
Original: $2.29
-56%Relife 10CC 183℃ No-Clean Syringe Solder Paste Flux for BGA Repair—
$2.29
$1.00Description
Relife RL-403 High Quality 10CC Syringe Solder Paste Flux Soldering Paste Tin Sn63 / Pb67 20-38um for Phone Motherboard BGA Soldering Repair.
Specification:
Features:
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive.
Note: solder paste can only be sent out by special post mail.
Package includes:
Specification:
- Name: Relife RL-403 183℃ solder paste (syringe)
- Specifications: 10cc
- Alloy: Sn63/Pb37
- Microns: 20-38um
Features:
- Good adhesion. Paste delicate, particles small, only 20~38 microns.
- Excellent wettability. After opening, the surface remains moist for 36 hours. Does not affect the welding.
- Lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding
Application: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc Solder paste lead solder at room temperature melting point 183 ℃ / forming fast and easy to weld conductive.
Note: solder paste can only be sent out by special post mail.
Package includes:
- 1pc x Relife RL-403 Solder Paste
